Chip Production Process

Today, we will show you around the chip production line, then you will get a comprehensive understanding of how to produce UVC chips. Is it helpful?

UVC Industry Chain

UVC Industry Chain

1. Epitaxy

Epitaxy is the most important, most critical, and most technologically content link in the entire LED industry. The technology process of UVC epitaxy includes MOCVD, laser marking, XDR measurement, and microscope inspection.  Details>>

2. Chip

The technical route of the chip mainly adopts the flip-chip technology route, including epitaxial growth, Mesa etching, P/N electrode, ISO etching, insulating layer deposition, pad evaporation, substrate thinning, chip scratching, and test sorting. Details>>

3. Package

The technology process of UVC package includes solid crystal, eutectic, plasma cleaning, heating and drying, dispensing, split, spectroscopy and taping. It can not only fix and seal the chip, but also enhance its electrothermal performance. Details>>

4. Module

UVC module is a widely used product in UVC products, which consists of package, circuit boards, power cords and related heat dissipation components. Each UVC module has a specific function, and it is designed to have sterilization and other special properties in a certain environment. Details>>

+ Project

UVC technology can be widely applied to different industries, scenarios and environments, such as home, mother and infant, cosmetics, travel, automotive, medical, food & drink, and commercial industry. Details>>

UVC Chip Process

Mesa Etching

Mesa Etching

After acid cleaning and photolithography, the UVC epitaxy is etched by Mesa to expose the N area, preparing for the ohmic contact of the N electrode.

P/N Electrode

Heat the vapor-deposited material under certain vacuum conditions to melt (or sublime) and form a vapor composed of atoms, molecules or groups of atoms, which will condense on the surface of the epitaxy wafer to form a film in preparation for the ohmic contact between the P and N electrodes.

P/N Electrode
ISO Etching

ISO Etching

The part of the lower layer material that is not masked by the upper layer masking film material is removed by physical and/or chemical methods, so as to obtain a pattern completely corresponding to the masking film pattern on the lower layer material. ISO etching effectively removes gallium nitride material in the Mesa process.

Insulation

Silicon oxide deposition, insulation isolation, opening the P/N pole channel, preparing for the pad evaporation process.

Insulation
E-Beam

E-Beam

Refers to heating the vapor-deposited material under certain vacuum conditions to melt (or sublime) and form a vapor composed of atoms, molecules or atomic groups, which condense on the surface of the pad substrate to form a film.

Thinning & Grinding

The chip alumina substrate is thinned by thinning to remove excess alumina and improve the heat dissipation effect of the chip. Thinning to a certain thickness is beneficial to the later packaging process.

Thinning & Grinding
Split

Split

The entire chip is punched and diced by laser to vaporize the aluminum oxide on the substrate, and then a single chip is obtained by a splitter.

Testing & Sorting

Test various photoelectric parameters of the chip, and then classify the chip according to different photoelectric parameters.

Testing & Sorting

Let's Work Together!

Whether it is ordering a UVC sample to take your design to the next step or planning to start a new UVC project this is where to get connected with what you need.

Headquarter

Building 14, Zone B, Digital Economy Industrial Park, No.136 Yuhai East Road, Hangzhou Bay New District, Ningbo, Zhejiang Province

(+86) 0574-58010899

project@annsemic.com

Branch

No. 425 Block A, Huafeng Internet + Creative Park, Gonghe Industrial Road, Xixiang Street, Bao’an District, Shenzhen, Guangdong Provice

(+86) 136 3165 9615

sales@annsemic.com