Package Production Process
Today, we will show you around the package production line, so you will get a comprehensive understanding of how to produce UVC packages. Is it helpful to you？
UVC Industry Chain
Epitaxy is the most important, most critical, and most technologically content link in the entire LED industry. The technology process of UVC epitaxy includes MOCVD, laser marking, XDR measurement, and microscope inspection. Details>>
The technical route of the chip mainly adopts the flip-chip technology route, including epitaxial growth, Mesa etching, P/N electrode, ISO etching, insulating layer deposition, pad evaporation, substrate thinning, chip scratching, and test sorting. Details>>
The technology process of UVC package includes solid crystal, eutectic, plasma cleaning, heating and drying, dispensing, split, spectroscopy and taping. It can not only fix and seal the chip, but also enhance its electrothermal performance. Details>>
UVC module is a widely used product in UVC products, which consists of package, circuit boards, power cords and related heat dissipation components. Each UVC module has a specific function, and it is designed to have sterilization and other special properties in a certain environment. Details>>
UVC technology can be widely applied to different industries, scenarios and environments, such as home, mother and infant, cosmetics, travel, automotive, medical, food & drink, and commercial industry. Details>>
UVC Package Process
The process of bonding the chip to the designated area of the bracket through glue (usually conductive glue or insulating glue for LEDs) to form a thermal path or an electrical path to provide conditions for subsequent wire bonding.
The alloy liquid of a certain composition is cooled, solidified, and crystallized into a mixture of two or more dense crystals at the eutectic reaction temperature.
Plasma cleaning is also called Plasma Surface Treatment Apparatus. It is a brand-new high-tech technology that uses plasma to achieve effects that cannot be achieved by conventional cleaning methods.
After the package are cleaned by plasma, they are cleaned by water or other liquids to achieve further cleaning results.
Heating and Drying
The surface of the lamp bead is dried after being turned on and heated.
The dispensing machine dispenses glue at a specific position of the package bracket to facilitate the next step of the cover.
The cover plate machine fully seals the package holder with the quartz glass or sapphire cover plate, and then cures it in a high-temperature oven to play the role of waterproof, dust-proof and isolation from the outside world.
The whole package bracket board is cut and separated into a single package.
After the packages are cleaned, dried, and dried at high temperature, the spectrometer analyzes and classifies the package according to photoelectric parameters such as voltage, band, and color temperature, and rejects defective products.
The taping machine classifies the package according to the band, voltage and other photoelectric parameters in a variety of combinations.
Let's Work Together!
Whether it is ordering a UVC sample to take your design to the next step or planning to start a new UVC project this is where to get connected with what you need.
Building 14, Zone B, Digital Economy Industrial Park, No.136 Yuhai East Road, Hangzhou Bay New District, Ningbo, Zhejiang Province
No. 425 Block A, Huafeng Internet + Creative Park, Gonghe Industrial Road, Xixiang Street, Bao’an District, Shenzhen, Guangdong Provice
(+86) 136 3165 9615